Nexstrom Raises $12M to Scale 2D Semiconductor Production
Singapore startup Nexstrom raises $12 million to scale North Star equipment for growing ultrathin 2D semiconductors directly on commercial 300mm wafers.
Summary
On September 22, 2026, Singapore startup Nexstrom announced a $12 million seed round from Xora Innovation, Foothill Ventures and SEEDS, bringing total funding to $15 million. Incubated by Xora, Nexstrom is developing North Star equipment to grow transition-metal dichalcogenides directly on commercial 300mm, 12-inch wafers. These not literally 2D materials are only a few atomic layers thick and could reduce leakage, power loss and heat as silicon transistors become harder to shrink and data center demand prolongs the global component shortage.
Chief scientist Lance Li, who led post-silicon electronics research at TSMC and has studied 2D materials since 2012, is targeting the gap between small laboratory samples and full-wafer production. CEO Phoebe Tan said Nexstrom's newly installed 12-inch system has produced material meeting partners' specifications after scaling from 2-inch to 6-inch wafers. Tan listed two 8-inch completions by October's end, although the repeated size leaves the intended second milestone unclear. Unnamed potential customers are testing samples. TSMC, Samsung, Intel, IMEC, ASML, AIXTRON and CDimension are pursuing related technology, with TSMC, ASML and IMEC already demonstrating 2D transistors in a 300mm integration process. Nexstrom plans to supply or partner with chipmakers rather than compete with them, using the funding for process control, measurement, hiring and customer qualification before targeted commercial production between 2030 and 2035.
Positives
- $12 million in seed funding lifts Nexstrom's total capital to $15 million.
- North Star grows transition-metal dichalcogenides directly on commercial 300mm, 12-inch wafers.
- Nexstrom has progressed from 2-inch to 6-inch wafers and produced specified material using its installed 12-inch system.
- Potential customers are already testing Nexstrom's wafer and material samples.
- TSMC, ASML and IMEC have demonstrated that 2D transistors can enter a 300mm integration process.
Risks & concerns
- Consistent transition-metal dichalcogenide growth across an entire production wafer remains the central manufacturing challenge.
- Commercial production is not expected until 2030 to 2035.
- Nexstrom declined to identify the companies testing its samples, limiting visibility into customer demand.
- Tan repeated 8 inches for both October milestones, leaving the intended second wafer size unclear.
- TSMC, Intel, IMEC, AIXTRON, CDimension and other startups are pursuing competing parts of the 2D semiconductor supply chain.
